VIGON RC 101
For reflow ovens and wave solder systems, water-based
Based on the MPC® Technology, VIGON® RC 101 was specifically developed to remove all types of baked-on flux residues from reflow and wave solder equipment. It reliably removes re-condensated fluxes and emissions from assemblies.

Advantages compared to other cleaners:
Has no flash point and therefore can be applied directly onto cold or warm surfaces (30 – 40 °C / 86 – 104 °F)
The medium does not contain any ingredients, which could leave residues on the oven surfaces. This avoids harmful condensations on the assembly surfaces after restarts
Due to the short soaking time, a quick and efficient cleaning process can be achieved and long machine downtimes can be avoided

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SDS VIGON RC 101 2020 English